Heatsink for COM Express Basic Embedded Computer Modules

Intel® Core™ i3, i5, i7 , Intel® Celeron® 800 series , AMD R-Series Generation

The specifications for COM Express™ Embedded Computer Modules include a heatspreader.
It's a mechanical definition of the thermal interface.  
All the heat generated by components such as chipsets and processors are transferred to the system's cooling via the heatspreader.
Various heatsinks and Cooling solutions for different system integration project.  

Odoo CMS - a big picture

Asia Pacific

10F-3, No. 270, Sec 4, Chung Hsiao E. Road, Taipei, 10694, Taiwan
Phone: +886-2-2751-7192
Email: [email protected]


Ulrichsberger Str. 17, Haus G1, 94469 Deggendorf, Germany
Phone: +49-991-2009298-0
Email: [email protected]


1420 Kettner BLVD. #300 , San Diego, 
CA 92101, USA

Phone: +1-760-525-1811 
Email: [email protected]

UK & Ireland

Phone: +44 (0) 7976-155552
Email: [email protected]

  • /
    • 12VH DC Fan Voltage :12 Vdc, 5500rpm (cable length 200mm, w/3 Pin, Pitch:2.54mm connector)
  • /
    • Aluminum
    • (COM Express Compact) Aluminum base 2mm~5mm with Thermal Stacks
COM Basic
  • Standard
    • 125(W) x 95(D) x 17(H) mm
  • Lite
    • 125(W) x 95(D) x 12(H) mm
  • Pro
    • 125(W) x 95(D) x 20(H) mm
COM Compact
  • Standard
    • 95(W) x 95(D) x 17 (H) mm
  • Lite
    • 95(W) x 95(D) x 12 (H) mm
  • Pro
    • 95(W) x 95(D) x 20 (H) mm
COM Mini
  • Heatsink
    • 84(W) x 55(D) x ***(H) mm