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Accessio
congatec
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SECO
 
SECOMEXP-ION
COM-Express™ Module with Intel® Atom® CPU and NVIDIA® ION Chipset with Dual Channel Memory
QUADMO747-XL
New board on Qseven™ form factor based on Intel® Atom™ Platform
Cooling Block for Qseven
Cooling Block for Qseven
EHS-QSA Series
Heatsink for Qseven
Standoff for Qseven Baseboard
Standoff for Qseven Baseboard
MXM Connector for Qseven

No MOQ, Next Day Shipment On Line Payment

news
SECO® presents the QUADMO747-X/OMAP module
congatec announces new COM Express small form factor module based on latest Intel® Core™ i7 processor
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