Cooler for COM Express Basic Embedded Computer Modules

Intel® Core™ i3, i5, i7 , Intel® Celeron® 800 series , AMD R-Series Generation

The specifications for COM Express™ Embedded Computer Modules include a heatspreader.
It's a mechanical definition of the thermal interface.  
All the heat generated by components such as chipsets and processors are transferred to the system's cooling via the heatspreader.
Various heatsinks and Cooling solutions for different system integration project.  

Odoo CMS - a big picture

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    • Aluminum
    • (COM Express Compact) Aluminum base 2mm~5mm with Thermal Stacks
COM Basic
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    • 125(W) x 95(D) x 17(H) mm
    • 125(W) x 95(D) x 20(H) mm
COM Compact
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    • 95(W) x 95(D) x 17 (H) mm
    • 95(W) x 95(D) x 20 (H) mm